High-Density Microwave Interconnect Module

The High-Density Microwave Interconnect Module primarily provides microwave signal transmission pathways for high-bit-count quantum chips. It enables stable cross-temperature-zone transmission of microwave signals in the extremely low heat-leakage environment of a dilution refrigerator. The system components include a sealed microwave integration module, a thermal anchoring microwave integration module, and a transmission line integration module. The sealed microwave integration module ensures a vacuum environment for quantum chip operation. The thermal anchoring microwave integration module incorporates attenuators of various specifications, providing efficient heat conduction for the cross-temperature-zone transmission line integration module. The transmission line integration module consists of integrated 12-channel cable sets that serve as signal transmission pathways.